Basic Research for Microsystems Integration
Description
- Project Title:
- Basic Research for Microsystems Integration
- Acronym:
- BARMINT
- Number:
- 8173
- Work Area:
- New Concepts for Top-Down Microsystem Design and the Simulation of Microsystem Performance
- Coordinator:
- LAAS/CNRS
7, avenue du Colonel Roche
F- 31077 Toulouse Cedex
- Coordinator Country:
- F
- Partners
- Universität Karlsruhe D
Technische Hochschule Darmstadt D
Centro National de Microelectronica E
Universitat de Barcelona E
Institut National Polytechnique de Grenoble F
National Microelectronics Research Center IRL
- Contact Point:
- Dr. E. Esteve
- Telephone:
- +33/61 521919
- Fax:
- +33/61 336208
- E-Mail:
-
- Keywords:
- microtechnology, microsystem, multichip multifunctional integrated modules
- Start Date:
- to be announced
- Duration:
- months
- Status:
- starting
- Abstract:
- BARMINT aims to identify and develop the methods, tools and technologies necessary for designing and fabricating silicon based microsystems in monolithic and multichip conditioning. A common demonstrator associating optical, mechanical and chemical functionalities will cluster the problems that are likely to be encountered in future industrial microsystems. It will thereby be used to propose solutions to the technological bottle-necks in compatibility and to develop basic methodologies for top-down microsystem design.
AIMS
BARMINT aims to design and integrate different functions (sensing, actuating, signal processing) using collective fabrication processes on silicon mono-substrates or using silicon multichip modules, so as to arrive at generic, low cost, efficient, complete microsystems.
APPROACH AND METHODS
To attain these goals, a "common demonstrator for compatibility studies" has been defined which combines all the difficulties already identified in microsystem design and fabrication:
- necessity of a global top-down design for microsystems: multi-technologies, multi-functionalities.
- solving compatibility problems between various technologies : mechanical, optical.
- design (CAD) of the heterogeneous system : analog, digital, interfaces of dissimilar nature : sensors, actuators, power supply.
- 3D assembly and conditioning.
The work will involve the following steps:
- definition of a demonstrator and existing software tools analysis based on technical and economical considerations,
- interdisciplinary design and implementation
- global design process
- identification of specific new design tools
- implementation taking into account compatibility and 3D assembly problems.
- integration and implementation of microsystem demonstrators for medical engineering and microrobotic applications.
POTENTIAL
Practical benefits in three sectors are anticipated:
- "Top-down" design: New integrated tools will be evaluated. These tools will allow the functional simulation of complete microsystems as well as the simulation of special technologies: micromachining, sealing, 3D connection.
- Compatibility of technologies: Processes will be defined in order to obtain compatibility between technologies of different nature such as VLSI, mechanical and optical micromachining, sealing, chemical membranes.
- 3D assembly operations. The project aims to start by using the "CUBIC" process which appears as one of the most promising. Its exact impact and limits for low dimensional and heterogeneous nature assembly will be established.
Sven Müßig, last update 07-nov-1995. Your feedback is welcome.